Temp-Plate® Usage in Semi-Conductor, Silicon Wafer, and Integrated Circuit Manufacturing

Wahl has specially designed Temp-Plate labels for quality assurance during the production of semi-conductors, silicon wafers, and integrated circuits.  The heating and curing portion of a semi-conductor production line is critical to fabricating the high quality components demanded by state-of-the-art electronics manufacturers.  Temp-Plate® labels are applied to the silicon substrate during the manufacturing process to ensure the correct curing temperatures are met, and that the materials are not weakened by overheating during this production step.

Silicon Wafer Manufacturing Process in Action

Wahl Temp-Plate® 450 Series Labels are specially designed to withstand the rigors of semi-conductor production.  The reverse printed, Kapton labels are designed to withstand exposure to high heat, vacuums, and corrosive gases.

450-043VC

450 Series Temp-Plate® Labels measure 0.2″ (5mm) high and 0.65″ (16.5mm) wide, and are Made in the USA.

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